High Performance (Water Cooled) Heat-pipe Heat Exchanger
Heat-pipe IGBT Coolers
Heat-pipe Processor Coolers
In this application a Heat-pipe is being used to stabilise the temperature of a sensor head of an
infra-red gas analyser which is for use in environmental control monitoring equipment. The Heat-pipe is
mounted via its heat sink mounting block to a temperature controlled heat sinking plate.
Power dissipation 40W with only 35° C rT from ambient.
Here a clustered array of Heat-pipes are used in a high temperature gas flow manifold where over 5 kW
of heat energy is transferred to cooling water, and the gas on temperature may exceed 700°C. Heat-pipe systems
may be used to great advantage providing lighter more compact assemblies than the conventional systems they replace.
These modular Heat-pipe units offer one of the most optimal solutions for providing practical and lightweight,
performance cooling of power semi-conductors. Typically, they are used in traction applications to cool electronic
drive controllers. Simply to install, the units require no maintenance other than occasionally cleaning. Power Rating:
Typically these units are normally designed to handle 2 kW to 3 kW per module with fan force air cooling.
Processor
cooling is an ever increasing and demanding challenge. Heat-pipe
cooling provides an optimal solution. Direct finning to the Heat-pipe
is very effectively utilised as the Heat-pipe very evenly distributes
the heat flux to each fin, and therefore higher fin bank efficiencies
are possible than can be realised with conventional finned heat sinks.
Rating: Performance typically 0.35°C/W with 70 W dissipation, although
better than 0.09°C/W is also possible.
Descrioption
igh temperature gas flow manifold where over 5 kW
of heat energy is transferred to cooling water, and the gas on temperature may exceed 700°C. Heat-pipe systems
may be used to great advantage providing lighter more compact assemblies than the conventional systems they replace.
